Ex-situ TEM grid with four electrical contacts (10 pack)

Ex-situ TEM grid for four-point electrical transport measurements before and/or after TEM imaging.  Ex situ grids have 3 mm diameter (corner-to-corner), making them compatible with most standard TEM instruments and holders.  0.5 mm pad spacing allows electrical contact to be made with off-the-shelf FFC clamps, precluding the need for wire-bonding or probe station (6 grids/pack).

Membrane region features 4 thin 40 nm-thick imaging regions, surrounded by a thicker (180 nm) region for ease of imaging, with high durability.  Four electrode widths (0.5, 1, 2, 4 um) are available to accommodate different sample sizes.  8 additional electrodes are available for optional e-beam lithography for adding additional contacts (e.g. a top gate).

(More info on ex-situ grids.)